CAS No.: | 919-30-2 |
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Formula: | C9h23no3si |
EINECS: | 213-048-4 |
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ANALYSIS ITEM | STANDARD | TEST DATA | TEST METHOD |
Appearance Purity(%) APHA(Hz) Density(20ºC,g/cm3) Refractive Index(nD25) |
Yellowish or Colorless Transparent Liquid ≥98.0 ≤30 0.9350~0.9550 1.4135~1.4235 |
Colorless Transparent Liquid 98.8 10 0.9493 1.4210 |
Q/HBXLT008-2022 |
Plastic Molding and Mold Adhesive: A highly effective adhesive for mold materials, ideal for use in thermoplastic molding, particularly suitable for complex geometric shapes and high-temperature applications.
Electronic Insulation Materials: A versatile insulator used in the production of electronic components, offering protection against electromagnetic interference and ensuring reliable operation.
Composite Material Reinforcement: Improves the properties of composites, such as flexural strength, chemical resistance, and durability, when used as a reinforcing agent.
Silicon Foam and Insulation Materials: A versatile and durable material for producing insulation andfoam, ideal for applications across various industries where thermal insulation is required.
Electronic Patch and Package Adhesion: A durable adhesive for electronic patching and packaging, ensuring secure bonding and protection of sensitive components.
Processing Improvement for Industrial Materials and Rubber: Enhances the processing of plastic, rubber, and related materials, particularly useful when high temperatures or accelerated aging processes are involved.
Silicon Material Enhancement: Improves the properties of silicon-based materials, such as increased flexibility and resistance to chemical attack, making them more suitable for a wide range of applications.